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Old September 20, 2012, 08:56 AM   #48
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Join Date: November 12, 2000
Location: Colorado Springs, Colorado
Posts: 9,494
I believe the bonding process would have less failures if the inside of the cases were deoxidized. Think how plumbers clean their copper & brass fittings with a wire brush so the solder will bond properly. Flux stops the oxidation from occuring from the heat of the torch as you (solder). As noted, it takes less flux than you think it might, but the case will have to be squeaky clean first.
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